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Schaumburg, IL, June 25, 2019 (GLOBE NEWSWIRE) -- Visitors to this July’s SEMICON West 2019 trade show will have the rare opportunity to learn about “Where Accuracy Meets Throughput” at the HEIDENHAIN and ETEL joint show booth in San Francisco, CA (July 9 – 11). Here, daily presentations will be given by HEIDENHAIN and ETEL experts highlighting this year’s application focus of Fan-Out Wafer-Level Packaging. This trend demands both a high accuracy and high throughput motion system, especially at the wafer reconstitution process step. In fact, at every wafer level package process step, HEIDENHAIN and ETEL have advanced motion solutions that are ready for the future.
The short presentations will be given three times during each day (11 a.m., 1 p.m. and 3 p.m.) at their show booth #851 in the Moscone Center. An opportunity to discuss these topics directly with the experts is available after each presentation.
Many state-of-the-art products will also be on display at the HEIDENHAIN/ETEL booth, including but not limited to HEIDENHAIN brands:
Dr. Johannes HEIDENHAIN GmbH, headquartered in Traunreut, Germany, develops and supports motion control feedback solutions for the machine tool, semiconductor, electronics assembly and test, metrology, automation, medical, energy, biotechnology and other global markets. HEIDENHAIN employs approximately 6,000 people worldwide in its core business activities. The North American subsidiary is HEIDENHAIN CORPORATION, headquartered in Schaumburg, IL, and San Jose, CA, and has been serving the U.S. industry for over 50 years. www.heidenhain.us
ETEL S.A. is based in Switzerland with exclusive North American distribution through HEIDENHAIN CORPORATION in Schaumburg, IL.
Digital image available at :
NUMERIK JENA LIKgo : https://www.heidenhain.us/wp-content/uploads/LIKgo_new_02.55-1.jpg
Kathleen Stoneski HEIDENHAIN CORPORATION 8475194702 email@example.com